Join Eric in his discussion with Steve Sandler, expert in power integrity, where they discuss past technology revolutions, the future of 2000 A chips, and why you should cook a pizza at 1000 degrees.

Join Eric in his discussion with Piyush Sevalia, EVP of marketing at Si Time where they discuss the value of high reliability, cost-effective clocks that enable the next generation of products from doorbells to data centers.

Join Eric in his discussion with Patrick Connally, Technology Architect at Teledyne LeCroy, where they discuss the future of high speed serial links and the challenges of keeping eyes open in the next-generation systems.

Join Eric Bogatin in his conversation with Juliano Mologni and John McDonald from Ansys as they discuss the latest developments in chiplet simulation and EMI problems and solutions.

Join Eric Bogatin in his conversation with Tim Wang Lee, SI/PI Application Scientist at Keysight Technologies, and learn the latest about ADS features and chiplet signal integrity challenges.

Join Eric Bogatin in his conversation with Chris Loberg from Tektronix and learn about how oscilloscopes are becoming the Swiss Army Knife of the lab.

Join Eric Bogatin in his conversation with Doug Sandy, CTO of PICMUG, to learn about open standards in high speed digital communications channels . Check out more information about PICMG here.  PICMG | Open Standards for Embedded Computing Applications

Join Eric Bogatin in his conversation with Stephen Scearce, the director of hardware engineering at Cisco, where they discuss the practical problems and solutions Cisco faces in designing and shipping 112 Gbps systems in high-volume production.

Join Eric for his chat with Lee Hill, EMC industry expert, as they talk about Lee’s journey into EMC and some of the problems he solves for his customers. Here is Lee’s web site: EMC and EMI Courses - SILENT Solutions LLC (silent-solutions.com)

Join Eric in his conversation with Heidi Barnes, Senior Applications Engineer at Keysight Technologies. Listen in as Eric and Heidi discuss her encounter with a Great White, which somehow puts power integrity problems into perspective. Also learn about some of the challenges in characterizing power supplies that supply as much as 2,000 Amps.

Join Eric in his conversation with Scott McMorrow, Strategic Technologist for Signal Integrity Products with Samtec. Listen in as Eric and Scott discuss some of the problems the industry faces implementing 224 Gbps systems and some of the cool solutions Samtec offers. For more information about Samtec, check out gEEk® SpEEk webinars  https://blog.samtec.com/geekspeek/  and other Samtec offerings https://www.samtec.com/.

Join Eric in his conversation with Chris Keimel, the cofounder and CTO of Menlo Micro. Listen in as Chris explains how a new MEMS based switch technology may enable new system solutions in high-speed serial links, data centers, power delivery, electrification of the grid and 5G communications. For more information about Menlo Micro, check out their web site here: https://menlomicro.com/.

Join Eric Bogatin, technical Editor of Signal Integrity Journal in his conversation with Yuriy Shlepnev, founder and president of Simberian. Eric and Yuriy discuss some of the challenges in high-speed interconnects design, such as  the use of return vias adjacent to signal vias, the role of statistical analysis in leading edge designs and the new super easy to use interface to Simbeor. You can check out more information about Simbeor at https://www.simberian.com/.

Eric Bogatin, Technical Editor at Signal Integrity Journal, chats with Leo Bodnar, the CEO of Bodnar electronics, to discuss some of the cool high performance DIY products he has created. Leo Bodnar Electronics are designers and manufacturers of various electronic products ranging from versatile USB controllers to racing simulator force feedback steering systems. They supply useful accessories that include push buttons, rotary encoders and switches and custom-built products include motor controllers for bicycles, high altitude balloons communication systems, video test equipment, RF signal generators, network time protocol servers. His website is http://www.leobodnar.com/shop/.

Join Eric Bogatin in episode 16 as he talks with Robert Feranec, president and CEO of Fedevel Academy, to learn about the go to spot for hardware engineers to sharpen their design skills. Robert's content teaches schematic and PCB design with his online courses. To find more information about training for hardware engineers, check out these web sites:https://marketplace.fedevel.education/ and https://youtube.com/robertferanec. This episode was sponsored by: Rohde & Schwarz.

Tim McDonald, president of Electro Magnetic Applications, and Cesar Mendez Ruiz, SI engineer at Intel discuss work to simulate the interactions and interference of a whole server at once as the ultimate way of understanding their products with Pat Hindle, Media Director at Signal Integrity Journal. For more information, read the Ansys/Intel case study here.

Join Eric in his conversation with Ken Johnson, Director of Marketing and Product Architect at Teledyne LeCroy, in episode 15 where they discuss the history and market for oscilloscopes, features important to engineers, and future trends in their development. This episode was sponsored by: Rohde & Schwarz.

Eric talks with Jay Diepenbrock in episode 14 about his background in the industry and efforts working with the IEEE disaster recovery teams to bring back communications and power for hurricane victims. This episode was sponsored by: Rohde & Schwarz.

Join Eric Bogatin when he chats with Ben Dannan, a technical fellow at an Aerospace and Defense company in episode 13. They cover topics ranging from measuring sub milli-ohm PDNs to designing DDR systems and performing measurement-simulation correlations. This episode was sponsored by: Rohde & Schwarz.

Join Eric Bogatin, SIJ Technical Editor in episode 12, in his conversation with Jason Ellison, Principal signal integrity engineer at Amphenol, and listen to the discussion about the challenges in designing 112 Gbps connector systems. This episode was sponsored by: Rohde & Schwarz.