Materials are the surface upon which all the interconnects are placed. If the material specification cannot accommodate UHDI, the boards will not be successful. John Johnson explains the implications of material choices for UHDI.
Adhesives and coatings are responding to changing industry requirements in innovative ways. Doug Katze delivers a master class on adhesive technologies, their individual appeal in electronics manufacturing, and the market needs driving all this innovation.
Solder mask: So easy to just gloss over this step but when UHDI is involved, you'd best not. John Johnson explains the crucial adjustments to be made even with solder mask in order to open up UHDI's full potential.
Circuit test, inspection, and failure analysis are enjoying a rapid increase in capabilities and sophistication. Test companies, such as Datest, are capable of testing methods we could only dream of ten years ago. Learn how Datest uses their expertise to not only perform high-quality failure analysis, but also to become a valuable DFT resource for the design team.
Continuing our discussion with ASC's John Johnson, we explore the pluses and minuses of copper plating microvias from the perspective of the fabricator and the designer.
Nolan Johnson and ASC's John Johnson explore the implications of UHDI on via from a designer's perspective. The metallurgy, chemistry, mechanics, and stackup reduction mean that designers have fewer constraints with UHDI.
Solder joint reliability is essential to product performance and longevity in electronics. Failures can lead to costly repairs, dissatisfied customers, or even catastrophic loss, depending on the application. In this Voices of the Industry episode, Marcy LaRont talks with Shantanu Joshi of KOKI America about how advanced materials—such as crack-free fluxes and zero-flux-residue solder pastes—are helping address challenges like voiding, heat dissipation, and reliability in demanding environments.
John Johnson continues this series, outlining UHDI's contributions to reduced SWaP—size, weight and power—considerations.
In a thoughtful conclusion to the series, Kuldip Johal connects the key themes, examining market drivers, the technological implications of semiconductor advances, and strategies for aligning PCB production with evolving market demands.
American Standard Circuits' John Johnson details how the new capabilities in UHDI can fundamentally change what it means to design for manufacturability.
Because solder formulations have been enjoying rapid development in the low-temperature solder arena, co-author Pritha Choudhury, senior R&D scientist with MacDermid Alpha, joins Nolan Johnson to discuss the update to The Printed Circuit Assembler's Guide to Low- temperature Soldering. Topics covered include details on key performance traits in low-temperature solder, and Choudhury shares her recommended low-temperature soldering solution.
John Johnson leads the way straight into UHDI's benefits to RF style design.
To launch this series, ASC's John Johnson introduces us to ultra-high-density interconnect. Johnson sets the agenda for further discussion by sharing practical reasons why UHDI could be key to your next design challenge, and why both designers and the manufacturing chain are excited by UHDI's potential.
Patrick Brooks discusses the role of wet processes—in conjunction with laser systems—in delivering on the “Optimize the Interconnect” idea. One example is Bondfilm, a unique coating that allows CO2 lasers to more effectively ablate copper than ever before.
Laser via drilling is a critical process window for MKS's Optimize the Interconnect concepts. Casey Kruger joins the podcast to explain exactly how the CO2 laser technology has been harnessed to create more accurate vias, faster, and in a smaller, more energy-efficient footprint.
MKS' Atotech's Frank Bruening and Roger Massey join us to discuss the emerging complexities in achieving optimal interconnect, and the key role chemistry plays. Their examples of the interplay between laser drilling, the chemical makeup of the substrate layers, and the plating process are worth a listen.
We continue our conversation with Chris Ryder on the Optimize the Interconnect(SM) concept. Chris shares some specific examples and details how and why industry leaders are adopting the OTI approach.
Beth Turner joins the podcast to discuss her book, The Printed Circuit Assembler's Guide to Encapsulating Sustainability for Electronics. The conversation ranges from the most common encapsulation materials used, to when and why to use them. Turner points out that encapsulation materials are also experiencing a creative time with respect to both performance and sustainability. A must-read for anyone with a role in specifying or applying encapsulation materials.
OTI, or "optimize the interconnect," is a concept approach to producing higher quality, higher complexity PCB products. Chris Ryder, MKS Director of Business Development, introduces the concept and sets the stage for a more detailed discussion.
Martyn Gaudion spills the tea on his third book, sharing more secrets for successful high-speed design.
