When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 99 – Scott Jordan, Head of Photonics, Physik Instrumente
Manufacturing Matters
26 minutes
6 months ago
Episode 99 – Scott Jordan, Head of Photonics, Physik Instrumente
The waveguides, modulators, microscopic lasers, photodetectors, and other optical components that form photonic integrated circuits (PICs) all need to be perfectly aligned to minimize signal loss on the chip. PICs simply cannot improve yields, lower costs, or efficiently scale without ever-faster alignment tools able to perform with nanometer precision. In this episode, TECH B2B’s Dan McCarthy chats with Physik Instrumente’s Scott Jordan about the advanced alignment tools and AI algorithms th...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
