When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 117 – Debra Phillips from NEMA and Tom Lawton of TESCO Metering
Manufacturing Matters
50 minutes
4 weeks ago
Episode 117 – Debra Phillips from NEMA and Tom Lawton of TESCO Metering
In this episode of Manufacturing Matters, podcast host Winn Hardin speaks with Debra Phillips from NEMA and Tom Lawton of TESCO Metering about the impacts of tariffs on American markets. Winn’s guests share how both large and small enterprises are dealing with new complexities and supply chain management issues that started during the pandemic and continue during new tariff negotiations between global markets. They also discuss a number of efforts, including NEMA’s new Make It American progra...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
