When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
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When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
Episode 102 - Suzy Teele, Chief Strategy Officer, ARM Institute
Manufacturing Matters
26 minutes
5 months ago
Episode 102 - Suzy Teele, Chief Strategy Officer, ARM Institute
"We must teach kids that they can be a manufacturer too – not just a doctor, lawyer, or fireperson. You get to work with cutting-edge machines and with your hands, but we haven’t really been able to create this feeling yet." There’s a lot of work to be done when it comes to reaching down further into school systems to help them understand, and to help teachers and faculty understand that manufacturing is a viable career, said Suzy Teele, Chief Strategy Officer at the ARM Institute. In this e...
Manufacturing Matters
When you walk into a data center and see thousands of cables connecting endless rows of servers, you're only viewing the tip of the bandwidth iceberg. The real bandwidth revolution is happening inside the semiconductor chip packages driving those connections. Wolfgang Sauder, Senior Distinguished Engineer at Marvell Technology, takes us deeper into the world of advanced semiconductor packaging, where the future of AI and data processing is being built on ever higher density chip connect...
