台積電法說會：匯損、先進製程與全球布局 歡迎收聽本集節目，深入解析台積電2025年第二季的最新財報與未來展望！ 本集將帶您了解台積電在第二季如何繳出亮眼成績單，營收達到300.7億美元，歸屬母公司業主之本期淨利成長超過60%。這主要得益於強勁的AI和高效能運算(HPC)相關需求，以及領先業界的3奈米與5奈米技術的支援。我們也將探討第三季的業績展望，預期營收將介於美金318億元到330億元之間，以及公司預期**2025年全年美元合併營收將成長近30%**的樂觀預期。 此外，節目將深入探討台積電的全球製造佈局，包括其在美國亞利桑那州、日本熊本和德國德勒斯登的擴建計畫，以及在台灣持續進行的大規模投資。您會聽到關於N2、N2P、A16與A14等先進製程技術的最新進展，這些技術將滿足對能源效率運算日益增長的需求。我們也將討論CoWoS先進封裝技術如何因應AI需求的爆炸性成長，公司正努力縮小需求與供給之間的差距。 最後，本集將總結台積電如何透過技術領先、卓越製造與客戶信任，持續鞏固其全球半導體產業的關鍵地位，並為股東帶來可觀的獲利成長。不要錯過這集，一同掌握半導體產業的脈動！ In this episode, we’ll explore how TSMC delivered an outstanding performance in Q2, with revenue reaching US$30.07 billion and net income attributable to shareholders growing by more than 60%. This remarkable growth was largely driven by surging demand for AI and high-performance computing (HPC), supported by TSMC’s industry-leading 3nm and 5nm technologies. We’ll also look ahead to Q3, where projected revenue is expected to land between US$31.8 billion and US$33 billion, and the company remains optimistic about achieving nearly 30% year-over-year growth in full-year revenue for 2025. 🌍 Beyond the numbers, we’ll delve into TSMC’s global manufacturing strategy—including expansion plans in Arizona, USA, Kumamoto, Japan, and Dresden, Germany, alongside significant ongoing investments in Taiwan. Expect updates on advanced process nodes like N2, N2P, A16, and A14, designed to meet the rising demand for energy-efficient computing. We’ll also unpack how the explosive growth in AI applications is fueling demand for CoWoS advanced packaging technology, and how TSMC is working to close the supply-demand gap. 🔚 To wrap up, we’ll summarize how TSMC continues to secure its pivotal role in the global semiconductor industry through technological leadership, manufacturing excellence, and customer trust—delivering strong value and returns to its shareholders. Don’t miss this episode—stay ahead of the curve in the ever-evolving world of semiconductors!