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3D InCites Podcast
Francoise von Trapp
181 episodes
3 days ago
Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
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Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
Show more...
Technology
Business,
News,
Marketing,
Tech News
https://is1-ssl.mzstatic.com/image/thumb/Podcasts211/v4/32/ef/d8/32efd848-38c4-af0b-bc77-9d190d318a5a/mza_18237462610871532091.jpg/600x600bb.jpg
The Unseen Force Behind Semiconductor Device Reliability
3D InCites Podcast
43 minutes
1 month ago
The Unseen Force Behind Semiconductor Device Reliability
Send us a text A semiconductor wafer travels around the globe five times on average before becoming the chip in your smartphone. Each journey represents a potential risk to device reliability that few consumers—or even industry professionals—ever consider. Behind every high-performing semiconductor device lies a carefully orchestrated logistics operation ensuring these sensitive components arrive intact and functioning. As Francoise von Trapp discovers in this eye-opening conversation with J...
3D InCites Podcast
Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...