Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
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Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
From Tape-Out to Co-Design: The Evolution of 3DIC Technologies
3D InCites Podcast
36 minutes
5 months ago
From Tape-Out to Co-Design: The Evolution of 3DIC Technologies
Send us a text Pratyush Kamal explains how 3DIC technologies are transforming semiconductor design as Moore's Law slows, requiring closer integration between chip and package design to maximize performance. • Traditional chip design treated packaging as an afterthought with designers "throwing designs over the wall" • Economic realities of advanced nodes mean companies now pay more for smaller transistors, driving chiplet adoption • Thermal challenges multiply in 3D stacks as power density d...
3D InCites Podcast
Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
