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3D InCites Podcast
Francoise von Trapp
181 episodes
3 days ago
Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
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Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
Show more...
Technology
Business,
News,
Marketing,
Tech News
https://is1-ssl.mzstatic.com/image/thumb/Podcasts211/v4/32/ef/d8/32efd848-38c4-af0b-bc77-9d190d318a5a/mza_18237462610871532091.jpg/600x600bb.jpg
First Impressions, Lasting Paths at IMAPS Symposium 2025
3D InCites Podcast
20 minutes
1 month ago
First Impressions, Lasting Paths at IMAPS Symposium 2025
Send us a text We record live at IMAPS to follow a first-time attendee’s leap into advanced packaging and a trio of high school students discovering semiconductors, robotics, and career paths that bridge disciplines. Along the way, we unpack speed-to-market, standards, hybrid vs TCB, and why AI skills matter. • why a self-funded first conference can reset a career • key takeaways from PDCs and technical talks • time-to-market pressure across packaging workflows • standards tension between fr...
3D InCites Podcast
Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...