Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
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Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
Chip Champions: How The 3D InCites Award Winners Are Revolutionizing Heterogeneous Integration
3D InCites Podcast
1 hour
7 months ago
Chip Champions: How The 3D InCites Award Winners Are Revolutionizing Heterogeneous Integration
Send us a text The 3D InCites Podcast celebrates microelectronics industry innovation with a special episode featuring this year's award winners in heterogeneous integration and chiplet technology. • SallyAnn Henry, Jim Straus and David Wang, ACM Research, describe a horizontal rotation plating system for panel-level packaging with superior uniformity across square substrates • Eric Gongora, of MacDermid Alpha, explains how NovaFab fine-grained copper enables hybrid bonding with customizable...
3D InCites Podcast
Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
