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3D InCites Podcast
Francoise von Trapp
181 episodes
3 days ago
Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
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Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...
Show more...
Technology
Business,
News,
Marketing,
Tech News
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Building The U.S. Microelectronics Workforce; A Collective Plan for Sustainable Semiconductors
3D InCites Podcast
31 minutes
2 weeks ago
Building The U.S. Microelectronics Workforce; A Collective Plan for Sustainable Semiconductors
Send us a text A nationwide talent engine for chips is taking shape—and it’s built to scale. Recorded live at SEMICON West in Phoenix, we sit down with SEMI Foundation leaders to unpack the National Network for Microelectronics Education, a hub-and-node model designed to align schools, employers, and workforce systems. Backed by CHIPS Act funding through the National Science Foundation, NNME will fund multi-state regional nodes that modernize curricula, streamline upskilling, and share proven...
3D InCites Podcast
Send us a text The floor in Phoenix was packed, and so were the ideas. We sat down with innovators across the stack—equipment makers, metrology experts, logistics strategists, and software leaders—to map the real state of advanced packaging and what it takes to build, measure, move, and power tomorrow’s chips. EV Group kicked things off with a candid look at die-to-wafer realities: activation on film frame, then 100% overlay metrology that measures tens of thousands of points per hour so eve...