As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
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As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
3D IC designs are complex puzzles that engineers have to solve to achieve high performance and reliability. While vertical stacking gives more design options, it also increases the possible number of defective arrangements. There is no one-design-fits-all in 3D IC; engineers must understand their needs and create designs that meet them.
Today, John McMillan interviews John Ferguson, Product Management Director of Calibre DRC Technologies at Siemens Digital EDA. He’ll help us understand the complexity of 3D IC designs and how it impacts their reliability.
In this episode, you’ll learn about some of the guardrails that increase the reliability of 3D IC devices. You’ll also hear about some of the common challenges an engineer has to solve while designing such devices. Additionally, you’ll get some tips on where to start with 3D IC designs to minimize cost and maximize performance.
What You Will Learn in this Episode:
Improving the reliability of heterogeneous assemblies (01:36)
Solving the heat problem in heterogeneous assemblies (07:46)
The sources of mechanical stress in 3D IC assemblies and how to address them (14:44)
Where to start when designing 3D IC devices (22:07)
Connect with John Ferguson:
LinkedIn
Connect with John McMillan:
LinkedIn
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3D IC
As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
