As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
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As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
From Chiplets to Systems: Overcoming the Hidden Pitfalls of 3D IC Design
3D IC
17 minutes
3 months ago
From Chiplets to Systems: Overcoming the Hidden Pitfalls of 3D IC Design
What does “multiphysics” really mean in 3D IC design—and why is it more important than ever to start early?
What you’ll discover:
Learn how early predictive multiphysics analysis can help prevent thermal, stress, and electrical failures later in the design cycle
Understand the collaboration challenges across die, interposer, packaging, and RTL teams—and how to unify them
Hear real-world insights on how system-level ownership and EDA platforms reduce risk in complex 3D IC projects
Get up to speed on emerging standards like 3D Blocks and 3D PDKs that are shaping the future of chiplet integration
Discover how simulation and digital twin strategies enable more accurate system-level behavior modeling
In this episode of the Siemens 3D IC Podcast, host John McMillan is joined by returning guest John Ferguson, Senior Director of Product Management for Calibre 3D IC Solutions at Siemens EDA, and first-time guest Tarek Ramadhan, Application Engineering Manager for 3D IC Technical Solutions.
Together, they explore why traditional SoC methodologies fall short in the 3D world, how early predictive analysis can save teams from costly late-stage surprises, and why effective collaboration across domains (and companies) is essential. From thermal and stress concerns to data format mismatches and emerging standards like 3D Blocks, this episode delivers powerful insight into future-ready 3D IC design.
👉 Ideal for IC designers, system architects, packaging engineers, RTL and ESD teams, and anyone involved in the transition from 2D to 3D IC workflows.
Find what you’re looking for:
How is the design process shifting from 2D and 2.5D to 3D IC (2:25)
What is multi-physics, and how does it impact 3D IC design? (5:00)
The hidden collaboration pitfalls between die, interposer, and packaging teams (7:30)
How is it impacting collaboration between companies or within companies and between teams? (10:45)
The role of new standards like 3D Blocks and 3D IC PDKs (13:10)
How emerging standards like 3D Blocks and 3D IC PDKs are streamlining design workflows (14:30)
Final thoughts (16:00)
Connect with John McMillan
LinkedIn
Website
Connect with Tarek Ramadan
LinkedIn
Website
Connect with John Ferguson
LinkedIn
Website
3D IC
As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
