As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
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As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
From 2.5D to True 3D IC: What’s Driving the Next Wave of Integration
3D IC
18 minutes
1 month ago
From 2.5D to True 3D IC: What’s Driving the Next Wave of Integration
How do you transition from today’s 2.5D systems into tomorrow’s true 3D IC architectures — while balancing cost, performance, and thermal demands?
What you’ll learn…
Where hyperscalers and AI accelerator developers are leading the 3D IC adoption curve.
Why design enablement and ecosystems are still evolving for mainstream adoption.
The tipping points that push companies toward 2.5D/3D IC designs.
The new methodology requirements: system-centric, predictive, shift-left modeling.
Why siloed design teams can’t meet the demands of advanced 3D IC.
How Siemens’ portfolio and AE expertise help customers adapt tools, methods, and organizations for success.
What you’ll discover…
(01:40) Current state of 3D IC adoption: hyperscalers, AI accelerators, and beyond.
(04:20) 3D VS 2.5D design and (hybrid bonding, stacking, bridges).
(05:30) Why customers want to learn more about 3D IC design.
(06:50) Why do customers move over to 3D IC design?
(08:25) Challenges in 3D IC design.
(10:20) Methodology shifts: early system-level planning and predictive modeling
(13:30) Siemens’ broad portfolio, roadmap collaboration, and multi-physics modeling
(15:45) The 5-year outlook: chiplet standards, system-on-wafer, and power/thermal battles
More about this episode…
In this episode of the Siemens 3D IC Podcast, host John McMillan speaks with Kevin Rinebold, 3D IC Packaging and Account Technology Manager at Siemens EDA. With over 35 years of customer-facing experience, Kevin shares insights into the evolution of advanced packaging, chiplet integration, and the methodologies needed for the next wave of 3D IC adoption.
The discussion covers how hyperscalers are driving AI and high-performance compute with 2.5D and emerging 3D approaches, why design enablement remains uneven across the supply chain, and what’s required to balance thermal, power, and signal considerations at scale. Kevin emphasizes that 3D IC isn’t just a technical challenge; it’s an organizational shift toward integrated, cross-disciplinary collaboration.
He also highlights Siemens’ role in enabling customers to “shift left,” evaluate tradeoffs early, and leverage a broad portfolio of tools and expertise to meet the complexity of future 3D IC designs. Looking ahead, Kevin points to maturing chiplet standards, system-on-wafer architectures, and the ongoing battle to get power in and heat out of dense 3D IC stacks.
Ideal for: IC packaging engineers, 3D IC architects, chiplet designers, substrate fabricators, and verification professionals navigating the shift from 2.5D to 3D integration.
Connect with John McMillan
LinkedIn
Website
Connect with Kevin Rinebold
LinkedIn
Website
3D IC
As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
