As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
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As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages
3D IC
10 minutes
2 months ago
Breaking Down 50 Million Pins: A Smarter Way to Design 3D IC Packages
How do you design and verify a package with tens of millions of pins — without losing months to manual rework?
What you’ll learn…
Why chiplet-based architectures demand new approaches to IC packaging
How hierarchical device planning reduces overwhelming complexity
The risks of spreadsheet-based workflows and why they’re no longer viable
How early, multi-domain analysis helps avoid costly late-stage redesigns
What Siemens’ Innovator 3D IC Portfolio offers for synchronized, error-proof design
Where you’ll find it….
(01:50) Current changes in IC Packaging and the impact on the whole ecosystem
(03:00) How to manage complexity scaling
(03:35) What hierarchical device planning is and why it matters
(05:00) How traditional methods fall short for high-pin-count designs
(06:20) The risks and consequences of package assembly errors
(07:00) What next-gen tools must deliver for designers
(09:10) Siemens’ Innovator 3D IC Portfolio overview
More about this episode…
In this episode of the Siemens 3D IC Podcast, host John McMillan speaks with Per Viklund, Director of IC Packaging and RF Product Lines at Siemens EDA, about the growing challenge of managing chiplet and interposer complexity in advanced 3D IC designs.
Per explains how hierarchical device planning enables designers to work at the right level of abstraction, streamlining the creation, optimization, and verification of massive, high-pin-count packages. The discussion covers why spreadsheet-based methods no longer cut it, the risks of unsynchronized workflows, and how early, multi-domain analysis can prevent costly late-stage redesigns.
The episode also introduces Siemens’ Innovator 3D IC Portfolio — a unified, AI-infused solution designed to support the entire packaging workflow, from early planning through final layout, with built-in data management to eliminate version errors.
Ideal for IC packaging engineers, 3D IC architects, chiplet designers, substrate fabricators, and verification professionals working on high-complexity designs.
Connect with John McMillan
LinkedIn
Website
Connect with Per Viklund
LinkedIn
Website
3D IC
As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
