As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
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As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
3D IC is Here—But Is Your Architecture Ready for It?
3D IC
16 minutes
5 months ago
3D IC is Here—But Is Your Architecture Ready for It?
As 3DIC adoption ramps up, it’s becoming clear: microarchitecture needs a rethink. So how do you design hardware that can survive and thrive in the new era of stacked silicon?
In this episode of the Siemens 3D IC Podcast, host John McMillan speaks with Pratyush Kamal, Director of R&D for 3D IC Solutions Engineering at Siemens Digital Industries. With decades of experience spanning Qualcomm and Google, Pratyush brings deep insight into the evolution of IC design—and how 3D integration is transforming every layer of the design stack.
From redefining how and when microarchitecture decisions are made to overcoming the thermal, testing, and failure analysis challenges that come with 3D stacking, this episode dives into the critical topics design teams need to understand today.
You’ll also hear how AI, automation, and cross-disciplinary expertise are reshaping team roles—and why software-defined silicon is redefining the design process itself.
This episode is essential listening for IC architects, system designers, and packaging engineers navigating the transition to advanced 3D IC platforms.
What You’ll Learn in this Episode:
What is microarchitecture in IC design? (2:30)
What does microarchitecture mean in 3D IC design? (3:20)
How early do we need to consider microarchitecture in 3D IC design? (4:45)
The main issues system designers face concerning the increasing complexity of microarchitecture (5:50)
How are roles changing to enable a more holistic outlook on 3D IC microarchitecture? (9:15)
What would enable non-silo design practice? (11:00)
Closing thoughts (11:55)
Connect with John McMillan
LinkedIn
Website
Connect with Pratyush Kamal
LinkedIn
Website
Explore More on 3D IC Innovation & Research:
Deepen your understanding of 3D IC design with these valuable resources:
Home | UCIe Consortium
Die Stacking (3D) Microarchitecture | IEEE Conference Publication | IEEE Xplore
Fine grain 3D integration for microarchitecture design through cube packing exploration | IEEE Conference Publication | IEEE Xplore
Opportunities, Challenges and Mitigations in 3DIC Design, Test, and Analyses | IEEE Conference Publication | IEEE Xplore
Design-Aware Partitioning-Based 3-D IC Design Flow With 2-D Commercial Tools | IEEE Journals & Magazine | IEEE Xplore
3D IC
As the semiconductor industry struggles with the limits of Moore’s Law, traditional monolithic scaling is no longer enough to meet performance, power, area and cost demands in technology, design, analysis, and manufacturing.
3D IC by Siemens is your go-to podcast for exploring the cutting-edge world of 3D IC packaging—a revolutionary approach reshaping semiconductor design, system integration, and heterogeneous computing.
Join industry leaders, engineers, and innovators as we break down advanced IC packaging solutions like 2.5D/3D IC, FCBGA, FOWLP, and more. Discover how chiplets, multi-die integration, and high-bandwidth memory (HBM) are driving higher performance, lower power consumption, and scalable architectures.
In each episode, we dive deep into the challenges and opportunities of IC design and manufacturing, including:
Roadmap for advanced packaging and heterogeneous integration in semiconductor scaling
Mainstream adoption of 3D IC—key challenges and breakthroughs
Optimizing micro-architecture and integration platforms for performance and efficiency
Strategic planning of chiplets and interposers for hierarchical device integration
Leveraging early predictive multi-physics analysis to enhance design accuracy
Automating design and routing for RDL-based fan-out wafer-level packaging (FOWLP)
Exploring glass substrates for superior electrical and thermal performance
Developing test-vehicles and daisy chain designs for architectural validation
Ensuring reliability and manufacturability in 3D IC heterogeneous integration
Mastering Signal Integrity (SI) and Power Integrity (PI) Analysis for high-speed systems
Managing thermal challenges in stacked die architectures
Subscribe now and stay ahead in the world of 3D IC.
Learn more: Siemens 3D IC Packaging Solutions
